Artist 3D has a broad range of expertise in both of flex and rigid-flex PCB manufacturing. From our quick turnaround times to our large selection of advanced raw materials to our strict quality control system, Artist 3D is the Rigid & flexible PCB manufacturer the reputation in business turn to for their extreme complex PCB projects.
| PCB Technical Capability | ||
| Flexible PCB | ||
| Item | Standard | Advanced |
| Layer count | 8L | 10L |
| Maxium PCB size | 2000*240mm | 2000*240mm |
| Min. line width/spacing | 0.04mm – 1/4OZ | 0.04mm – 1/4OZ |
| Min. line width/spacing | 0.05mm – 1/3OZ | 0.05mm – 1/3OZ |
| Min. line width/spacing | 0.055mm – 1/2OZ | 0.055mm – 1/2OZ |
| Min. PTH size | 0.15mm | 0.1mm |
| Min. PTH PAD size | 0.25mm | 0.2mm |
| Min. blind via diameter | 0.10mm | 0.075mm |
| Min. capture pad size | 0.25mm | 0.175mm |
| Min. solder mask bridge | 0.065mm | 0.065mm |
| Coverlay registration tolerance | 0.15mm | 0.10mm |
| PTH hole size tolerance | ±0.05mm | ±0.038mm |
| Contour tolerance | ±0.05mm | ±0.05mm |
| Impedance tolerance | ±8% | ±6%(for differential impedance) |
| Min. slot hole width | 0.60mm | 0.50mm |
| Pitch tolerance | ±0.05mm | ±0.03mm |
| Air Gap capability | YES | YES |
| Surface finish | ENIG, OSP, Gold plating(hard gold) | ENIG, OSP, Gold plating(hard gold) |
| Rigid PCB | ||
| Item | Standard | Advanced |
| Layer count | 40L | 56L |
| Board thickness | 5.5mm | 6.5mm |
| Aspect ratio | 10:1 | 14:1 |
| Copper thickness | 6OZ | 12OZ |
| 1 Layer Maxium PCB size | 500×2000mm | 500×2400mm |
| 2 Layer Maxium PCB size | 500×1200mm | 500×1200mm |
| ≥4L Maxium PCB size | 540*650mm | 540*650mm |
| Min. 4L board thickness | 0.38mm | 0.35mm |
| Min. hole & pad size | 0.20/0.40mm | 0.15/0.35mm |
| Drilling Acuracy | ±0.05mm | ±0.038mm |
| Min. solder mask bridge | 0.065mm | 0.065mm |
| PTH hole size tolerance | ±0.05mm | ±0.038mm |
| Contour tolerance | ±0.05mm | ±0.05mm |
| Impedance tolerance | ±8% | ±6%(Differential impedance) |
| Min. line width/spacing | 0.075/0.075mm | 0.065/0.065mm |
| Surface finish | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink |
| H D I | ||
| Item | Standard | Advanced |
| HDI stage | 3+N+3 | 1:1 |
| Min. 8L board thickness | 0.70mm | 0.65mm |
| Min. line width/spacing | 0.05/0.05mm | 0.05/0.05mm |
| Key line/tolerance | 0.065mm/15% | 0.06mm/10% |
| Min. blind via diameter | 0.10mm | 0.09mm |
| Min. capture pad size | 0.23mm | 0.20mm |
| Min. PTH diameter | 0.20mm | 0.175mm |
| Min. PTH PAD size | 0.35mm | 0.30mm |
| Min. clearance(copper to SM opening) | 0.038mm | 0.025mm |
| Min. solder mask bridge | 0.065mm | 0.065mm |
| Min. CSP/BGA pitch | 0.40mm | 0.35mm |
| PTH hole size tolerance | ±0.05mm | ±0.038mm |
| Contour tolerance | ±0.05mm | ±0.05mm |
| Impedance tolerance | ±8% | ±6%(for differential impedance) |
| Surface finish | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink | ENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink |