Capability

Artist 3D has a broad range of expertise in both of flex and rigid-flex PCB manufacturing. From our quick turnaround times to our large selection of advanced raw materials to our strict quality control system, Artist 3D is the Rigid & flexible PCB manufacturer the reputation in business turn to for their extreme complex PCB projects.

PCB Technical Capability
Flexible PCB
ItemStandardAdvanced
Layer count8L10L
Maxium PCB size2000*240mm2000*240mm
Min. line width/spacing0.04mm – 1/4OZ0.04mm – 1/4OZ
Min. line width/spacing0.05mm – 1/3OZ0.05mm – 1/3OZ
Min. line width/spacing0.055mm – 1/2OZ0.055mm – 1/2OZ
Min. PTH size0.15mm0.1mm
Min. PTH PAD size0.25mm0.2mm
Min. blind via diameter0.10mm0.075mm
Min. capture pad size0.25mm0.175mm
Min. solder mask bridge0.065mm0.065mm
Coverlay registration tolerance0.15mm0.10mm
PTH hole size tolerance±0.05mm±0.038mm
Contour tolerance±0.05mm±0.05mm
Impedance tolerance±8%±6%(for differential impedance)
Min. slot hole width0.60mm0.50mm
Pitch tolerance±0.05mm±0.03mm
Air Gap capabilityYESYES
Surface finishENIG, OSP, Gold plating(hard gold)ENIG, OSP, Gold plating(hard gold)
Rigid PCB
ItemStandardAdvanced
Layer count40L56L
Board thickness5.5mm6.5mm
Aspect ratio10:114:1
Copper thickness6OZ12OZ
1 Layer Maxium PCB size500×2000mm 500×2400mm
2 Layer Maxium PCB size500×1200mm 500×1200mm
≥4L Maxium PCB size540*650mm 540*650mm
Min. 4L board thickness0.38mm0.35mm
Min. hole & pad size0.20/0.40mm0.15/0.35mm
Drilling Acuracy±0.05mm±0.038mm
Min. solder mask bridge0.065mm0.065mm
PTH hole size tolerance±0.05mm±0.038mm
Contour tolerance±0.05mm±0.05mm
Impedance tolerance±8%±6%(Differential impedance)
Min. line width/spacing0.075/0.075mm0.065/0.065mm
Surface finishENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon inkENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink
H D I
ItemStandardAdvanced
HDI stage3+N+31:1
Min. 8L board thickness0.70mm0.65mm
Min. line width/spacing0.05/0.05mm0.05/0.05mm
Key line/tolerance0.065mm/15%0.06mm/10%
Min. blind via diameter0.10mm0.09mm
Min. capture pad size0.23mm0.20mm
Min. PTH diameter0.20mm0.175mm
Min. PTH PAD size0.35mm0.30mm
Min. clearance(copper to SM opening)0.038mm0.025mm
Min. solder mask bridge0.065mm0.065mm
Min. CSP/BGA pitch0.40mm0.35mm
PTH hole size tolerance±0.05mm±0.038mm
Contour tolerance±0.05mm±0.05mm
Impedance tolerance±8%±6%(for differential impedance)
Surface finishENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon inkENIG, OSP,Lead free HASL, Gold plating(hard gold),Immersion Silver, Immersion Tin, Tin plating, Silver plating, Carbon ink