Distinguish fabrication panels from delivery arrays
A fabricator may arrange boards on a production panel for its manufacturing process. The assembler may need a different array or handling format. State whether the delivered items are individual boards or an agreed assembly panel, including how quantity is counted.
For example, an order for 100 boards is different from an order for 100 panels containing four boards each. Record the board count per array and the shipment unit explicitly. Do not rely on the word “panel” to communicate both manufacturing utilization and the customer’s delivery expectation.
Choose separation around the actual board and components
Tab routing and V-scoring create different edge and separation conditions. Board shape, component proximity, material, thickness and the intended depaneling equipment influence the choice. A compact arrangement that saves panel area can still be unsuitable if separation stresses damage nearby components.
Agree on tab or score positions and any edge remnants permitted after separation. Small or irregular boards may need particular support. Include downstream inspection, testing and enclosure fit in the review rather than optimizing the bare-board panel in isolation.
Define the assembly interfaces
- Array dimensions, board orientation and number of units.
- Handling rails, tooling holes and fiducials.
- Component and copper keepouts for handling and separation.
- Support needs through printing, placement, soldering and test.
- Depaneling method and acceptance of the finished edges.
There is no universal panel size that suits every fabrication line and assembler. Ask both parties to confirm the proposed format. If the manufacturer prepares the array, provide the single-board authority and approve the resulting panel drawing before production.
Keep the panel data linked to the board release
Whether prepared in CAD or CAM, panelization should preserve the intended board geometry and revision. Inspect repeated outlines, drills, copper, mask and reference features. Check that tooling additions and marks do not enter a functional board area or conflict with components.
Record the accepted panel drawing with the assembly package and stencil. A changed array can require new tooling, stencil data or machine setup even when the individual circuit board has not changed. Quote those effects explicitly and verify the first panel through the complete process before scaling the build.