A Primer on Via Technology for PCB Designers

via in pcb

While vias have been present for a long time, advances in IC design tools and manufacturing methods have led to a dramatic increase in their use, such as in PCBs, in recent years.The printed circuit board (PCB) is crucial for every electronic device. It guarantees that the gadget works appropriately and offers a foundation for connecting the device’s parts. The vias, which are microscopic holes drilled into a PCB to facilitate electrical connections between the board’s various layers, are among its most crucial parts. They improve power delivery and signal integrity while assisting in board size reduction. We will thus delve further into Artist 3D’s vias, the many types of vias now in use, and their advantages and disadvantages.

What is a Via in PCB?

The abbreviation “via” stands for “via hole” or “via hole plating,” and it is a phrase used in the printed circuit board (PCB) design. It is an electrical connector that enables the routing of signals and power via different PCB layers. It comprises a copper-plated hole drilled into the circuit board to link components or traces on several circuit levels.

Types of Vias

what is via in pcb

1. Through-Hole Viaducts

Through-hole vias are metalized holes drilled into a printed circuit board (PCB) or substrate to connect two or more board layers. Additionally, through-hole vias help to create electrical connections between circuit components. Typically, through-hole vias are constructed of copper. However, other materials such as aluminum, brass, and thermally conductive materials can also be helpful. The most prevalent type of vias, through-hole vias, is oftenly useful in prototypes and manufacturing.

2. Blind Vias

The blind vias are metalized holes on a printed circuit board that link only two layers (PCB). Blind vias, unlike through-hole vias, have only one entry point, with the other end of the via entirely contained within the board. When space is restricted, or it is not possible to drill through the entire circuit board, blind vias are helpful. As they provide a reliable connection between the layers, blind vias are typically useful for power and ground signals.

3. Buried vias

Buried vias are metalized holes wholly encased between the layers of a printed circuit board (PCB). When the PCB is too dense to use traditional through-hole vias or the design calls for a densely packed interconnect system, buried vias are useful. Typically, buried vias are composed of copper and can be plated with any compatible material.

4. Microvias

Microvias are metalized holes with a smaller diameter than conventional through-hole vias, typically between 0.003″ and 0.01″. Printed circuit boards utilize microvias to reduce their size and complexity (PCB). Additionally, they help connect layers that are adjacent, such as adjacent layers in high-density interconnects.

5. Via-in-Pad

The via-in-pad technique helps connect two layers of a printed circuit board (PCB). This method eliminates the need for a separate via hole by placing a via directly on top of a pad or component. Via-in-pad is a cost-effective method for reducing the size and complexity of a printed circuit board (PCB) while providing a reliable connection between the layers.

6. Laser Vias

The laser vias are metalized holes drilled with a laser into a printed circuit board (PCB). Laser vias are helpful when the PCB is too dense to use traditional through-hole vias or when the design calls for a densely packed interconnect system. Engineers often plate the copper laser vias with any material compatible with the circuit board.

7. Stacked vias

To connect multiple layers of a printed circuit board, stacked vias are metalized holes stacked atop one another (PCB). In high-density interconnections, we use copper to make stacked vias. Typically, engineers plate them with any material compatible with the board.

8. Fan-Out Vias

Fan-out vias are metal-plated holes connecting multiple printed circuit board layers (PCB) to a single layer. The fan-out vias are typically helpful in high-density interconnects and are copper. Typically, their plating is any material compatible with the board.

9. Plugged Vias

Metalized holes filled with a conductive material such as solder or conductive epoxy constitute plugged vias. Plugged vias are typically useful when it is impossible to drill through the entire circuit board or when the design calls for a densely packed interconnection system. Additionally, we use them to reduce the size and complexity of PCBs.

10. Via-Filling

The technique of via-filling helps reduce the size and complexity of a printed circuit board (PCB). Filling the vias with a conductive material, such as solder or conductive epoxy, is the technique. Via-filling reduces the number of vias and connections required, thereby decreasing the board’s complexity.

Advantages of Vias

via in pad

In PCBs, vias have several benefits, such as:

  1. Enhanced performance and dependability 

Vias help creates electrical connections between two distinct layers of a substrate, improving the IC’s performance and reliability. Additionally, this is because vias can connect two layers, eliminating the need for extra wires and connections. Vias can also lessen the number of signal reflections, which can improve signal integrity.

  • Less space needed:

By obviating the need for extra wire or connections, vias can minimize the size of a chip. Given how expensive it may be to fabricate an IC, this could result in significant financial savings. Additionally, shrinking the size of a chip may make it possible to fit more components into a smaller space.

  • Cost-savings potential:

Vias can lower the price of producing an IC since they can minimize a chip’s area, reducing manufacturing costs. Vias can also cut down on the number of connections required, which can save money.

  • Increased signal integrity:

Vias can increase the signal’s integrity by reducing the number of signal reflections. This action is so that the vias can limit signal reflections by offering a direct electrical connection between two layers.

  • Better heat dissipation:

By supplying more routes for heat to escape, vias can make an IC’s heat dissipation more efficient. This aspect is because vias offer an extra layer of conductive material, which might improve the IC’s thermal conductivity.

Drawbacks of Vias in PCBs

Vias have several drawbacks when used in printed circuit board (PCB) design:

  1. Reliability: 

Vias on a PCB can be a site of failure, particularly if they are improperly plated or under a lot of stress. Inadequately plated vias may deteriorate over time and cause the PCB to fail. Additionally, vias put under high strain, such as in mechanically demanding applications, might malfunction mechanically or from fatigue.

  1. Challenges in manufacturing: 

Vias can be challenging to manufacture, particularly in high-density PCBs with many vias. Longer lead times and higher manufacturing costs may result from this. Drilling holes in the PCB, plating them, and filling them with conductive material are all steps in creating vias. The time and specialized equipment needed for this procedure might raise the cost of production.

  1. Thermal performance: 

Vias can lower a PCB’s thermal performance by reducing the heat that can flow away from components. This might be a concern in high-power applications where heat dissipation is essential.

  1. Electromagnetic interference (EMI) performance: 

Vias can affect a PCB’s EMI performance. Using vias, such as improperly terminated or insulated, can produce more EMI sources. Vias can also add extra EMI paths, facilitating easier EMI propagation via the PCB.

  • Signal loss: 

Due to the additional resistance that vias contribute, they might result in signal loss. Due to the potential for severe signal loss at high frequencies, this can be particularly troublesome.

  • Signal Cross-talk:

Cross-talk is when signals from one trace interfere with those from another path due to vias. In high-speed or high-frequency applications where signal integrity is essential, this can be a problem.

  • Design constraints:

Vias may result in restrictions on design, such as minimum through size and spacing requirements. These limitations may restrict the PCB designer’s design possibilities and necessitate more intricate routing techniques to satisfy the design specifications.


Suppose you need to reduce the number of connections in your design without sacrificing the reliability of the electrical connections between layers. In that case, Artist 3D’s vias are a great way to do so at a low cost. Vias are a crucial component of the contemporary electronics industry and serve a vital function in PCBs. By using Our Vias, designers can produce intricate, multi-layered PCBs with more effective routing and densely packed components. Moreover, by increasing solderable connections and lowering the possibility of thermal stress, vias also improve the performance and dependability of PCBs. Overall, they permit designers and engineers to reduce the chip’s area and hence the chip’s manufacturing cost.

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