Uyemura to Provide Solutions to eSurface Licensees

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Uyemura and eSurface Technologies Partner to Deliver Innovative PCB Surface Finishing Solutions

Uyemura, a global leader in advanced plating chemistry and surface finishing solutions, has announced a strategic partnership with eSurface Technologies to provide comprehensive support and solutions to eSurface licensees. This collaboration brings together Uyemura’s extensive expertise in electroplating and eSurface’s patented additive and semi-Additive Manufacturing processes for printed circuit boards (PCBs).

The Need for Advanced PCB Surface Finishing Solutions

As the electronics industry continues to evolve, there is an increasing demand for high-density interconnect (HDI) PCBs with finer features and improved signal integrity. Traditional subtractive manufacturing processes are reaching their limits in terms of feature size and reliability. eSurface Technologies has developed innovative additive and semi-additive processes that enable the production of ultra-fine features down to 5 microns or less.

However, these advanced processes require specialized surface finishing solutions to ensure optimal performance and reliability. This is where Uyemura’s expertise comes into play. With decades of experience in developing and supplying high-quality plating chemistry, Uyemura is well-positioned to provide the necessary solutions to eSurface licensees.

Uyemura’s Comprehensive Solutions for eSurface Licensees

Uyemura offers a wide range of surface finishing solutions that are tailored to meet the specific requirements of eSurface’s additive and semi-additive processes. These solutions include:

  1. Electroless Copper Plating: Uyemura’s electroless copper plating chemistry provides a uniform and conformal copper layer on dielectric surfaces, which serves as the foundation for subsequent plating processes. The chemistry is optimized for compatibility with eSurface’s processes and ensures excellent adhesion and reliability.

  2. Direct Metallization: Direct metallization is a key enabler for HDI PCBs, as it eliminates the need for electroless copper plating and reduces the number of process steps. Uyemura offers a range of direct metallization solutions, including palladium-based and copper-based systems, that are compatible with eSurface’s processes and provide excellent adhesion and productivity.

  3. Electrolytic Copper Plating: Uyemura’s electrolytic copper plating chemistry is designed to deliver high-quality copper deposits with excellent uniformity, adhesion, and mechanical properties. The chemistry is optimized for compatibility with eSurface’s processes and enables the production of fine features with high Aspect Ratios.

  4. Surface Finishes: Uyemura offers a variety of surface finish options, including immersion tin, immersion silver, electroless nickel/immersion gold (ENIG), and electroless nickel/electroless palladium/immersion gold (ENEPIG). These finishes provide excellent solderable, wire-bondable, and corrosion-resistant surfaces for PCBs manufactured using eSurface’s processes.

Benefits of the Uyemura-eSurface Partnership

The partnership between Uyemura and eSurface Technologies brings several key benefits to eSurface licensees:

  1. Proven Compatibility: Uyemura’s solutions have been thoroughly tested and validated for compatibility with eSurface’s processes. This ensures that licensees can achieve optimal results and avoid potential issues related to incompatible chemistry.

  2. Technical Support: Uyemura provides comprehensive technical support to eSurface licensees, including process optimization, troubleshooting, and training. This support helps licensees to implement and maintain high-quality surface finishing processes efficiently.

  3. Global Availability: With a global presence and an extensive distribution network, Uyemura can provide its solutions to eSurface licensees worldwide. This ensures a reliable supply of high-quality plating chemistry and reduces logistics challenges.

  4. Continuous Innovation: Uyemura is committed to continuous innovation in surface finishing technology. The company invests heavily in research and development to improve existing solutions and develop new ones that meet the evolving needs of the electronics industry. This benefits eSurface licensees by providing access to cutting-edge plating chemistry that enables them to stay ahead of the competition.

Benefit Description
Proven Compatibility Uyemura’s solutions are thoroughly tested and validated for compatibility with eSurface’s processes
Technical Support Uyemura provides comprehensive technical support, including process optimization, troubleshooting, and training
Global Availability Uyemura’s global presence and distribution network ensure reliable supply of high-quality plating chemistry worldwide
Continuous Innovation Uyemura invests in R&D to improve existing solutions and develop new ones that meet evolving industry needs

Case Studies: Successful Implementation of Uyemura-eSurface Solutions

Several eSurface licensees have already successfully implemented Uyemura’s surface finishing solutions in their manufacturing processes. Here are two case studies that demonstrate the benefits of this partnership:

Case Study 1: High-Density Interconnect PCBs for Automotive Applications

An eSurface licensee specializing in automotive electronics was facing challenges in producing HDI PCBs with fine features and high reliability. By implementing Uyemura’s direct metallization and electrolytic copper Plating Solutions, the licensee was able to achieve the following results:

  • Reduced feature sizes down to 10 microns
  • Improved adhesion and reliability of copper traces
  • Increased productivity by eliminating the need for electroless copper plating
  • Met stringent automotive quality and reliability requirements

Case Study 2: Advanced Packaging Substrates for 5G Applications

Another eSurface licensee was developing advanced packaging substrates for 5G applications, which required ultra-fine features and high signal integrity. By leveraging Uyemura’s electroless copper plating and ENEPIG surface finish solutions, the licensee achieved the following outcomes:

  • Produced features as fine as 5 microns with high aspect ratios
  • Improved signal integrity and reduced signal loss
  • Achieved excellent solderability and wire-bondability
  • Met the demanding performance requirements of 5G applications

These case studies demonstrate the effectiveness of Uyemura’s solutions in enabling eSurface licensees to produce high-quality PCBs and packaging substrates with advanced features and improved performance.

Frequently Asked Questions (FAQ)

  1. Q: What is the minimum feature size that can be achieved with Uyemura’s solutions for eSurface’s processes?
    A: Uyemura’s solutions enable eSurface licensees to achieve feature sizes down to 5 microns or less, depending on the specific process and application.

  2. Q: Are Uyemura’s solutions compatible with all eSurface’s additive and semi-additive processes?
    A: Yes, Uyemura’s solutions have been thoroughly tested and validated for compatibility with eSurface’s processes, ensuring optimal performance and reliability.

  3. Q: What type of technical support does Uyemura provide to eSurface licensees?
    A: Uyemura provides comprehensive technical support, including process optimization, troubleshooting, and training, to help licensees implement and maintain high-quality surface finishing processes efficiently.

  4. Q: How does Uyemura ensure the global availability of its solutions for eSurface licensees?
    A: Uyemura has a global presence and an extensive distribution network, which ensures a reliable supply of high-quality plating chemistry to eSurface licensees worldwide.

  5. Q: What are some of the key benefits of using Uyemura’s solutions for eSurface’s processes?
    A: The key benefits include proven compatibility, comprehensive technical support, global availability, and access to cutting-edge plating chemistry developed through Uyemura’s continuous innovation efforts.

Conclusion

The strategic partnership between Uyemura and eSurface Technologies represents a significant milestone in advancing PCB surface finishing solutions for additive and semi-additive manufacturing processes. By leveraging Uyemura’s expertise and comprehensive solutions, eSurface licensees can achieve optimal results, improve product quality, and meet the evolving demands of the electronics industry.

As the adoption of eSurface’s innovative processes continues to grow, the availability of compatible and high-quality surface finishing solutions from Uyemura will play a crucial role in enabling the production of advanced PCBs and packaging substrates. This partnership ensures that eSurface licensees have access to the necessary support and solutions to succeed in an increasingly competitive market.