Using Return Paths that Follow Least Impedance to create a better PCB Design
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Artist 3D
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Table of Contents
What are Return Paths and Why Do They Matter?
In printed circuit board (PCB) design, a return path is the route that current takes to complete a circuit and return to its source. Every signal trace on a PCB has a corresponding return path. The return path is typically provided by power and ground planes in the PCB Stackup.
Return paths are critical because they have a big impact on signal integrity and electromagnetic compatibility (EMC) in PCBs. Poor return paths can lead to:
Excessive loop inductance which degrades signal quality
Electromagnetic interference (EMI) issues
Crosstalk between signals
Ground bounce and power supply noise
Therefore, it’s essential to carefully design return paths in PCBs to ensure proper circuit operation and minimize EMI. One key principle for optimizing return paths is to route them such that they follow the path of least impedance.
The fundamental concept behind least-impedance return paths is that electric current always follows the path of least impedance. In other words, current wants to return to its source via the easiest possible route.
In a PCB, the path of least impedance is typically directly under the signal trace, through the power or ground plane. This provides the smallest possible current loop area and minimizes inductance.
However, if there are discontinuities or gaps in the return path plane, such as slots, splits, or cutouts, the return current will have to divert around them. This diverted return path will be longer and have higher impedance and inductance. The increased loop area can act like an antenna and cause EMI problems.
Therefore, the goal in optimizing PCB return paths is to provide continuous, uninterrupted return planes that allow currents to flow directly under their signal traces, following the path of least impedance. This minimizes current loops and helps contain electromagnetic fields.
Impact of Return Paths on Signal Integrity
Return paths play a critical role in maintaining signal integrity as signals traverse a PCB. One key signal integrity parameter impacted by return paths is loop inductance.
Loop Inductance
Loop inductance is a parasitic effect caused by the area enclosed by a signal and its return path. A larger loop area results in higher inductance.
In a transmission line, loop inductance combines with the capacitance between the signal trace and return plane to determine the Characteristic Impedance of the line. Excessive loop inductance can cause an impedance discontinuity which results in reflections and degrades signal quality.
Loop inductance also opposes fast changes in current. This can slow down signal edges and further degrade signal integrity, especially for high-speed signals.
By providing a continuous return path directly under the signal trace, loop area and inductance are minimized. This helps maintain constant impedance and good signal quality.
Crosstalk
Crosstalk is unwanted coupling of energy between signal traces. It’s caused by mutual inductance and capacitance between adjacent traces.
Poor return paths can worsen crosstalk. If a return path is interrupted, return currents may flow through nearby power/ground planes which couples more easily to other signals.
Properly designed return paths that follow least impedance help contain electric and magnetic fields around signal traces and reduce crosstalk.
Impact of Return Paths on EMI
Electromagnetic interference (EMI) is another major concern in PCB design. Components and traces on a PCB can act as small antennas, radiating energy and causing interference. Poor return path design is a leading cause of PCB EMI issues.
Common-Mode Radiation
When a return path is interrupted and diverted around an obstacle, a voltage differential can develop between the signal and return currents. This voltage differential can drive common-mode currents on cables and cause them to radiate like antennas.
Designing continuous return paths minimizes this common-mode conversion and radiation.
Magnetic Field Radiation
Current flowing through a loop creates a magnetic field perpendicular to the loop area. A larger loop area creates a larger magnetic field that can radiate more easily.
Least-impedance return paths minimize loop area and help contain magnetic fields to mitigate this radiation mechanism.
Designing Least-Impedance Return Paths
Now that we understand the importance of least-impedance return paths, let’s look at some specific design techniques to achieve them in PCBs.
Provide Continuous Return Planes
The most important rule for good return paths is to provide continuous, uninterrupted return planes for power and ground. Avoid splitting or cutting gaps in these planes whenever possible.
If cuts or splits are unavoidable, such as for high-voltage isolation, provide stitching capacitors across the split to maintain AC continuity for high-frequency currents. Differential signals should have their own local uninterrupted return planes.
Avoid Return Path Discontinuities
Besides plane splits, other plane features can cause return path discontinuities:
Slots and cutouts
Traces crossing splits/gaps
Via transitions to other layers
Plane layer transitions
Whenever a signal trace must traverse one of these discontinuities, the return path is interrupted and diverted. To minimize this effect:
Route signals over solid planes, not splits/gaps
Provide stitching vias near signal vias transitioning layers
Provide ac stitching capacitors across plane splits
Avoid references planes that change layers
High-Speed Signals and Return Paths
High-speed and RF signals are especially sensitive to return path design. As signal frequencies increase, the path of least impedance becomes even more localized under the trace.
For these signals, the return plane should be as close as possible to the signal layer – preferably adjacent. Provide ground floods around signal traces and locate stitching vias as close as possible to signal vias.
Differential pairs should be routed over a continuous, uninterrupted return plane to maintain good common-mode rejection. Avoid referencing to different planes which can cause imbalance.
Power Return Paths
Although often neglected, power distribution traces also have return paths that must be considered. Power currents want to return to their source (typically a voltage regulator or power supply) via the path of least impedance, just like signal currents.
One common issue is the use of “star” power/ground routing schemes. While this may seem optimal for DC, at high frequencies the return currents will not follow the star traces but will want to flow directly back to the source. If the star traces do not provide a least-impedance path, the return currents may flow through unintended paths like I/O cables and cause EMI.
A better solution is to use power and ground planes which intrinsically provide low-impedance paths. The planes should cover as much area as possible and not be unnecessarily segmented. This allows high-frequency decoupling currents to easily return to their source.
FAQs
Q1: What is a return path in PCB design?
A1: A return path is the route that current takes to complete a circuit and return to its source. In a PCB, the return path is typically provided by power and ground planes. Every signal trace has a corresponding return path.
Q2: Why are return paths important in PCBs?
A2: Return paths are critical because they impact signal integrity and electromagnetic compatibility (EMC). Poor return paths can cause excessive loop inductance, crosstalk, ground bounce, and radiated EMI.
Q3: What is meant by a least-impedance return path?
A3: The principle of least-impedance return paths recognizes that current always wants to return to its source via the path of least impedance. In a PCB, this is typically directly under the signal trace, through an uninterrupted return plane. This minimizes loop area and inductance.
Q4: How do discontinuities in a return path impact performance?
A4: If there are discontinuities or gaps in the return path plane, such as slots or cutouts, the return current must divert around them. This diverted path will be longer with higher impedance and inductance. The increased loop area can degrade signal integrity and cause EMI problems.
Q5: What are some key design techniques for good PCB return paths?
A5: Some key techniques include:
Providing continuous, uninterrupted power and ground planes
Avoiding slots, gaps, and splits in planes when possible
Using stitching capacitors and vias to maintain return continuity
Referencing high-speed signals to adjacent, uninterrupted planes
Using solid power/ground planes instead of “star” routing
Conclusion
Return path design is a critical but often overlooked aspect of PCB layout. Carefully designing return paths to follow the path of least impedance is essential for maintaining signal integrity and minimizing EMI.
By understanding the impact of return paths and applying specific layout techniques like continuous planes, avoiding discontinuities, and proper high-speed referencing, designers can create PCBs that are more robust and have better electromagnetic compatibility.
While it may not be possible to achieve perfect least-impedance return paths in every case, striving to optimize them to the greatest extent possible will help ensure PCBs that perform well and minimize EMI in their end applications.