Review components and design inputs
Confirm the exact part numbers, symbol pins and footprint pads before committing the layout. Check component variants and polarity against the package documentation. Preserve the project and library versions used for the approved design.
Define the outline, holes, layer construction and mechanical constraints. Agree manufacturing rules for the proposed copper and interconnect features. Keep electrical requirements separate from default software settings.
Complete and inspect the layout
Review placement, routing, reference paths and copper areas with the actual circuit requirements. Inspect connector access, component height and test points as part of the assembly. Run the available checks and document accepted exceptions.
Reconcile schematic and board changes before exporting. A successful connectivity check does not establish that a footprint, thermal path or mechanical interface is correct. Include a focused review of the highest-risk parts of the design.
Generate the agreed manufacturing package
DipTrace’s official tutorial and help describe manufacturing exports, including Gerber and N/C drilling. Follow the instructions for the installed version and confirm the format accepted by your supplier.
Export into a clean folder with a clear revision name. Identify copper layers, mask, legend, outline and drilling; supply stencil data when required. Keep units and coordinate origins consistent and explain plated versus non-plated features.
Verify outputs and control the handoff
Open the actual exported files in a viewer and check dimensions, layer alignment, holes, slots and critical pads. For assembly, compare the BOM and placement output against the board references, sides and rotations.
Supply the fabrication drawing, requested quantity and assembly notes with the file set. Archive the exact release and record any approved manufacturing changes. Use first-article inspection and functional testing to confirm the intended build.