Define the supported hardware platform
Identify the processing or mining devices, power architecture, interfaces and firmware required by the product. Use authorized design information and confirm component availability. A board cannot be made compatible with an arbitrary algorithm or device by changing fabrication settings.
Provide the exact BOM and permitted alternatives. Package compatibility alone does not establish electrical or firmware equivalence. Keep product configuration and component identity traceable through procurement and assembly.
Review current distribution and thermal paths
Evaluate supply entry, connectors, conductors, vias and local regulation under the intended workload. Check voltage drop and local heating across the entire power path. Avoid relying on copper weight alone as proof of current capability.
Coordinate heatsinks, thermal interfaces, airflow and mechanical loading with the populated board. Define installation requirements so cooling hardware does not bend the PCB or overstress components. Test the actual assembly configuration.
Plan assembly and inspection
Review package handling, soldering requirements and inspection access. Hidden joints may need appropriate imaging or electrical coverage. Define cleaning, protection and repair requirements before production.
Supply drawings for cooling hardware, bus connections and final assembly operations where they are in scope. Agree who provides specialized parts and how shortages or substitutions are approved.
Use measurable acceptance criteria
Define programming, communication, power and workload tests with clear limits and duration. Record temperatures, supply behavior and functional results against the hardware and firmware revision.
Manufacturing acceptance concerns the agreed assembly performance. It does not establish mining profitability, revenue or a return on investment. Request a project quote using the released files, quantities, cooling scope and test requirements.