FR 4 PCB material with TG

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Introduction to FR4-TG

FR4-TG is a high-performance printed circuit board (PCB) material that offers enhanced thermal and mechanical properties compared to standard FR-4. The “TG” in FR4-TG stands for “Tg,” which refers to the Glass Transition Temperature of the material.

What is Tg?

Glass transition temperature (Tg) is the temperature at which a polymer material transitions from a hard, glassy state to a soft, rubbery state. In PCB materials, a higher Tg indicates better thermal stability and resistance to deformation at elevated temperatures.

Advantages of High Tg in PCBs

PCBs made with high Tg materials like FR4-TG offer several advantages:

  1. Improved thermal stability
  2. Reduced thermal expansion
  3. Better mechanical strength at high temperatures
  4. Increased reliability in harsh environments

Properties of FR4-TG

FR4-TG is a laminate material composed of a woven fiberglass fabric impregnated with an epoxy resin system. The key difference between FR4-TG and standard FR-4 is the formulation of the epoxy resin, which is engineered to achieve a higher glass transition temperature.

Thermal Properties

Property FR4-TG Standard FR-4
Glass Transition Temperature (Tg) 170-180°C 130-140°C
Decomposition Temperature (Td) >320°C >300°C
Thermal Expansion Coefficient (CTE) 12-14 ppm/°C 14-17 ppm/°C

The higher Tg of FR4-TG results in improved thermal stability and reduced thermal expansion compared to standard FR-4. This makes FR4-TG suitable for applications that involve exposure to high temperatures or thermal cycling.

Mechanical Properties

Property FR4-TG Standard FR-4
Flexural Strength (MPa) 550-650 480-580
Young’s Modulus (GPa) 20-22 18-20
Tensile Strength (MPa) 400-450 350-400
Compressive Strength (MPa) 500-600 450-550

FR4-TG exhibits enhanced mechanical properties, particularly at elevated temperatures. The higher flexural strength and modulus of FR4-TG make it more resistant to bending and deformation, while the increased tensile and compressive strengths contribute to overall durability.

Electrical Properties

Property FR4-TG Standard FR-4
Dielectric Constant (1 MHz) 4.5-4.7 4.5-4.7
Dissipation Factor (1 MHz) 0.02-0.03 0.02-0.03
Surface Resistivity (MΩ) >10^5 >10^5
Volume Resistivity (MΩ·cm) >10^8 >10^8
Dielectric Breakdown Strength (kV/mm) >40 >40

The electrical properties of FR4-TG are similar to those of standard FR-4. Both materials offer good insulation, low dielectric losses, and high resistance to electrical breakdown.

Applications of FR4-TG

FR4-TG is widely used in applications that require high reliability and performance under demanding conditions. Some common applications include:

  1. Automotive electronics
  2. Aerospace and defense systems
  3. Industrial control and automation
  4. High-power LED lighting
  5. Telecommunications infrastructure

Automotive Electronics

In the automotive industry, FR4-TG is used for PCBs in various electronic systems, such as:

  • Engine control units (ECUs)
  • Transmission control modules
  • Power steering controllers
  • Brake control systems
  • Infotainment and navigation systems

The high Tg of FR4-TG ensures that these PCBs can withstand the extreme temperatures and thermal cycling encountered in automotive environments.

Aerospace and Defense Systems

FR4-TG is a popular choice for PCBs in aerospace and defense applications, including:

  • Avionics
  • Radar systems
  • Satellite communications
  • Military vehicles and equipment

The enhanced thermal and mechanical properties of FR4-TG make it suitable for use in harsh environments and mission-critical systems where reliability is paramount.

Industrial Control and Automation

In industrial settings, FR4-TG is used for PCBs in:

  • Programmable logic controllers (PLCs)
  • Motor drives and servo controllers
  • Power supplies and converters
  • Sensor and actuator interfaces

The improved thermal stability and mechanical strength of FR4-TG ensure that these PCBs can operate reliably in the presence of high temperatures, vibrations, and other demanding conditions.

High-Power LED Lighting

FR4-TG is an excellent substrate material for high-power LED lighting applications, such as:

  • Street and area lighting
  • Stadium and arena lighting
  • Industrial and commercial lighting

The high Tg of FR4-TG allows the PCBs to dissipate heat more effectively, which is crucial for maintaining the performance and longevity of high-power LEDs.

Telecommunications Infrastructure

FR4-TG is used in various telecommunications infrastructure applications, including:

  • Base station equipment
  • Fiber optic networks
  • Switches and routers
  • Data center hardware

The enhanced thermal and mechanical properties of FR4-TG ensure reliable performance in the demanding environments encountered in telecommunications infrastructure.

Manufacturing Considerations for FR4-TG

When designing and manufacturing PCBs using FR4-TG, there are several factors to consider to ensure optimal performance and reliability.

Design Guidelines

  1. Minimize thermal stress: Use proper layout techniques and copper balancing to minimize thermal stress on the PCB.
  2. Consider thermal expansion: Account for the difference in thermal expansion between FR4-TG and other materials, such as components and connectors.
  3. Optimize signal integrity: Follow best practices for signal routing, impedance control, and grounding to maintain signal integrity.

Fabrication Process

  1. Lamination: Use appropriate lamination parameters, such as pressure, temperature, and time, to ensure proper bonding of the FR4-TG layers.
  2. Drilling: Adjust drilling parameters, such as feed rate and spindle speed, to accommodate the higher mechanical strength of FR4-TG.
  3. Plating: Ensure that the plating processes, such as electroless copper and electrolytic copper, are compatible with FR4-TG and meet the required specifications.

Quality Control

  1. Visual inspection: Perform thorough visual inspections to identify any defects, such as delamination, blistering, or measling.
  2. Electrical testing: Conduct electrical tests, such as continuity, isolation, and impedance measurements, to verify the integrity of the PCB.
  3. Environmental testing: Perform environmental tests, such as thermal cycling and thermal shock, to ensure the PCB can withstand the intended operating conditions.


1. What is the main difference between FR4-TG and standard FR-4?

The main difference between FR4-TG and standard FR-4 is the glass transition temperature (Tg). FR4-TG has a higher Tg, typically 170-180°C, compared to 130-140°C for standard FR-4. This higher Tg provides improved thermal stability and mechanical properties.

2. Can FR4-TG be used for multilayer PCBs?

Yes, FR4-TG can be used for multilayer PCBs. The enhanced thermal and mechanical properties of FR4-TG make it suitable for demanding applications that require high layer counts and complex designs.

3. Is FR4-TG more expensive than standard FR-4?

Yes, FR4-TG is generally more expensive than standard FR-4 due to the specialized epoxy resin formulation and additional processing requirements. However, the improved performance and reliability offered by FR4-TG can justify the higher cost in demanding applications.

4. Can FR4-TG be used with lead-free soldering processes?

Yes, FR4-TG is compatible with lead-free soldering processes. The higher Tg of FR4-TG ensures that the material can withstand the elevated temperatures associated with lead-free soldering without experiencing significant degradation or deformation.

5. How does FR4-TG compare to other high-performance PCB Materials?

FR4-TG offers a good balance of thermal, mechanical, and electrical properties at a relatively lower cost compared to other high-performance PCB materials, such as polyimide or PTFE-based laminates. However, for extremely demanding applications, materials like polyimide or PTFE may be necessary to meet the required specifications.


FR4-TG is a high-performance PCB material that offers enhanced thermal stability, mechanical strength, and reliability compared to standard FR-4. With its higher glass transition temperature (Tg), FR4-TG is suitable for demanding applications in industries such as automotive, aerospace, industrial control, high-power LED lighting, and telecommunications.

When designing and manufacturing PCBs using FR4-TG, it is essential to consider factors such as thermal stress, thermal expansion, signal integrity, and compatibility with fabrication processes. Proper quality control measures, including visual inspection, electrical testing, and environmental testing, should be implemented to ensure the PCBs meet the required specifications and can withstand the intended operating conditions.

As technology advances and the demand for high-performance electronics continues to grow, FR4-TG will likely play an increasingly important role in enabling reliable and robust PCB solutions for a wide range of applications.